New Apps For 3D Chips

By Mark LaPedus Semiconductor Manufacturing and; Design sat down to discuss the 3D device challenges and applications with Peter Ramm, head of the department for device and 3D integration at Fraunhofer EMFT Munich, one of Europe’s largest research organizations. SMD: Fraunhofer was a pioneer in 3D chip R&D, right? Ramm: We are the oldest microelectronics institute in Germany. We st... » read more