What Works…And What Doesn’t

By Ed Sperling - 02 Apr, 2009 - Comments: 0

Lisa Su, chief technology officer at Freescale, talks about the future of system-level design, what's working and where the problems are. [youtube vid=zw5dUTuO7DY] » read more

Taming The Multicore Beast

By Ed Sperling - 27 Mar, 2009 - Comments: 0

By Ed Sperling Multicore chips are here to stay. Now what? That question is echoing up and down the ranks of tools vendors, design engineers, software developers and even among people who measure the performance and efficiency of semiconductors. There is now a Multicore Expo and a Multicore Association that includes a who’s who of electronics. And there are lots of working groups developing... » read more

Exploring The Use Of Virtual Platforms At The Electronic System Level

By Cheryl Ajluni - 27 Mar, 2009 - Comments: 0

By Cheryl Ajluni System design is hard. That should not come as a surprise to anyone these days. With design geometries shrinking and device complexity on the rise, this fact is not likely to change anytime soon. One concept for easing that burden for system-level designers is the virtual platform. Granted, the concept itself is nothing new, but today it is being employed in ever more creativ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Freescale

What Works…And What Doesn’t

Taming The Multicore Beast

Exploring The Use Of Virtual Platforms At The Electronic System Level