Blog Review: Jan. 22

By Ed Sperling - 22 Jan, 2014 - Comments: 0

Mentor’s Anil Khanna believes Nest’s approach should be incorporated into the entire power grid. The ramifications of that are interesting to ponder. Speaking of Nest, Cadence’s Brian Fuller looks at the implications of the $3.2 billion acquisition of the company by Google. Will Google get it right? Maybe. Synopsys’ Richard Solomon has come up with a new definition for New Year’... » read more

What Just Happened?

By Brian Fuller - 12 Dec, 2013 - Comments: 0

Boy that went by fast. One minute, I’m waking up a little groggy on New Year’s Day, wondering whether the silicon industry is ever going to rebound. The next minute, it’s today and the industry had a good year, and is, in many ways, a completely different animal than it was 12 months ago. Innovation is evolutionary, sure. But if you really think about 2013, you can make an argument tha... » read more

The “Last Simple Node” And the Internet of Things

By Brian Fuller - 17 Oct, 2013 - Comments: 0

Power, performance and size are key targets that will enable the expected explosion of the Internet of Things (IoT). Today, most observers see the path to that running directly through 16/14nm finFET and below for the node’s ability to manage power and size and boost integration. Geoff Lees isn’t your average observer. The vice president and general manager of Freescale’s microcon... » read more

The Week In Review: Aug. 19

By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

Experts At The Table: SoC Prototyping

By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss SoC prototyping with Hillel Miller, pre-silicon verification/emulation manager at Freescale Semiconductor; Frank Schirrmeister, group director, product marketing, for the system development suite at Cadence; and Mick Posner, director of product marketing at Synopsys. What follows are excerpts of that conversation. SLD: How... » read more

Life In A Connected World

By Qi Wang - 13 Jun, 2013 - Comments: 0

By Qi Wang At this year’s DA, we heard a lot of discussions on the Internet of Things. Gregg Lowe, CEO of Freescale, said in his keynote speech that by 2020 there will be 50 billion connected devices. Considering there are an estimated 4 billion devices in the world now, mostly unconnected, this represents huge growth potential for the semiconductor industry because each device will have at ... » read more

MEMS Goes Mainstream

By Ed Sperling - 29 Nov, 2012 - Comments: 0

By Cheryl Coupé Micro-electromechanical systems (MEMS) are well known for enabling innovative capabilities for devices that range from vehicles and gaming to smartphones and tablets—and increasingly in personal health and fitness, security, and environmental applications. As stacked die become more popular, they also will become part of the integration challenge that chipmakers will wrestle... » read more

Node Skipping Reaches New Heights

By Ed Sperling - 15 Nov, 2012 - Comments: 0

By Mark LaPedus For years, silicon foundries have rolled out their respective leading-edge processes roughly on a two-year cadence. The long-standing goal has been to keep foundry customers on a competitive price, power and performance curve. But as leading-edge chipmakers move from the 28nm node and beyond, the predictable process progression is changing. And the phenomenon of “node skip... » read more

The Good And Bad Of Models

By Ed Sperling - 27 Sep, 2012 - Comments: 0

By Ann Steffora Mutschler Driven by fierce competition and the fact that socket decisions are made long before silicon is manufactured, semiconductor companies today ship models and virtual prototypes to their OEMs very early in hopes of locking in the socket. Admittedly, this has been happening for some time, but due to complexity and the need for flexibility of models and virtual platf... » read more

The Rolling Stones Of Chipmaking

By Applied Materials Writers - 20 Sep, 2012 - Comments: 0

By Cheryl Knepfler In 1993, when the Internet was mostly a science experiment, Applied shipped a new P5000 CVD system to the Motorola SPS (now Freescale) Oak Hill fab in Austin, Texas— where it was used to produce processors for Apple computers. A year later, Motorola installed its second P5000 system. Fast forward 20 years and you’ll find both tools on the production line and still runnin... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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