tag: Friedrich-Alexander Universität Erlangen-Nürnberg

Research Bits: Aug. 30
By Jesse Allen - 30 Aug, 2022 - Comments: 0

Through glass vias Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say enables low transmission loss and high vacuum wafer-level packaging of high-frequency chips and MEMS sensors. TGV is a vertical interconnection technology applied in wafer-level vacuum packaging. The researchers found that it has goo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Foxconn (also known as Hon Hai Technology Group) is forming a joint venture (JV) with Yageo Group, a component production and process management company for EVs and other high-end electronics, to focus on the development of semiconductors under $2 USD, which they call “small ICs.” Through the JV, a new company called XSemi wil... » read more

Manufacturing Bits: Oct. 17
By Mark LaPedus - 17 Oct, 2017 - Comments: 0

WIMP dark matter detector The LUX-ZEPLIN (LZ) Group has taken another step towards finding an elusive part of the universe—dark matter. The LZ Group consists of 250 scientists and engineers from 37 institutions in the U.S., U.K., Portugal, Russia and Korea. In 2012, the group built the so-called Large Underground Xenon (LUX) dark matter detector. The detector is based on a 370 kilogram ... » read more

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