Going Open Source

By Dave Kelf - 26 May, 2016 - Comments: 2

Open Source often is thought of as an alternative to commercial software licensed using fairly typical business models. For example, variants of open source Linux supplied by companies such as Red Hat charge a subscription for support and maintenance. Maybe there is an opportunity to leverage Open Source alongside commercial EDA software to provide use model advantages and open development f... » read more

The Power Game

By Ann Mutschler - 11 Apr, 2013 - Comments: 0

By Ann Steffora Mutschler Semiconductor engineering teams always have focused on stepping up performance in new designs, but in the mobile, GPU and tablet markets they’re finding that maintaining the balance between higher performance and the same or lower power is increasingly onerous. The reason: Extreme gaming applications can create scenario files that cause dynamic power consumpt... » read more

Dealing With The Data Glut

By Ann Mutschler - 11 Apr, 2013 - Comments: 0

By Ann Steffora Mutschler Tools like emulation and simulation are an absolute necessity to design and verify today’s complex SoCs, but what happens when you want to do power analysis and the file sizes are too massive for the emulator to handle? Even with an emulator a five-minute mobile phone call could take three months. Understandably, this issue is causing pain to many design teams... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Going Open Source

The Power Game

Dealing With The Data Glut

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