Week In Review: Design, Low Power

By Marie C. Baca - 23 Sep, 2022 - Comments: 0

Quantum The $3 million Breakthrough Prize in Fundamental Physics was awarded to four pioneers in the field of quantum information. The laureates are Charles H. Bennett, Gilles Brassard, David Deutsch and Peter Shor. Bennett and Brassard were part of the team that proved the usefulness of entanglement, while Deutsch defined the quantum version of a Turing machine. Shor invented the first "clear... » read more

Week In Review: Design, Low Power

By Jesse Allen - 15 Jul, 2022 - Comments: 0

Tools & IP Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins. Future Facilities’ product portfolio includes an electronics thermal solution, as well as computational fluid dynamics (CFD) electronics cooling simulation technology that op... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 15 Jul, 2022 - Comments: 0

Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

The Week In Review: Design

By Jesse Allen - 23 Mar, 2018 - Comments: 0

M&A Synopsys acquired Silicon and Beyond, a provider of high-speed SerDes and ADC/DAC IP. The company was founded in 2012 as SilabTech and headquartered in Bangalore. Synopsys highlighted the team of R&D engineers with high-speed SerDes expertise that would be joining with the acquisition. Terms of the deal were not disclosed. ANSYS will acquire OPTIS, a provider of software for sci... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Future Facilities

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

The Week In Review: Design

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Knowledge Centers
Entities, people and technologies explored