Competing V2V Technologies Emerge, Create Confusion

By John Koon - 05 Jan, 2023 - Comments: 0

The battle over vehicle-to-vehicle communications technology has begun, as governments step back to see which of two main competing standards and lots of related technology are best suited for reducing accidents. V2V is an often-discussed wireless communication protocol that enables vehicles to communicate with each other, easing traffic congestion, avoiding accidents, and ultimately improvi... » read more

Improving Accuracy In Satellite Navigation Systems

By Bryon Moyer - 20 Oct, 2021 - Comments: 0

Increasing dependency on the global navigation satellite system (GNSS) constellations is raising concerns about what happens when signals are unavailable, even for short periods of time. GNSS systems affect our daily lives in ways we often don’t see, from location services to cell phone timing. In fact, these satellites have become a necessary part of critical infrastructure, and higher ac... » read more

The Week In Review: IoT

By Jeff Dorsch - 23 Jun, 2017 - Comments: 0

Finance Samsara, an Industrial Internet of Things startup, raised $40 million in its Series C financing, led by General Catalyst. Andreesen Horowitz, an existing investor, and Samsara’s founders also participated in the funding round, which values the company at $530 million. The supplier of Internet-connected sensors for industrial and transportation applications has raised a total of $80 m... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Galileo

Competing V2V Technologies Emerge, Create Confusion

Improving Accuracy In Satellite Navigation Systems

The Week In Review: IoT

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Entities, people and technologies explored