Week in Review: IoT, Security, Auto


Internet of Things Silicon Labs worked with Norway’s Q-Free to create the ParQSense Smart Parking Sensor, which helps drivers find available outdoor parking spaces. ParQSense uses the chip company’s Wonder Gecko wireless microcontroller for connectivity and control. Having gone through pilot testing in the European Union and North America this year, ParQSense is being released for commerci... » read more

Manufacturing Bits: Sept. 4


Flat diamond chips Kanazawa University and the National Institute of Advanced Industrial Science and Technology (AIST) have developed a process that solves a big issue for diamond semiconductors in power applications. Researchers have developed a water vapor annealing technique that creates atomically flat diamond surfaces. This brings diamond semiconductors one step closer to becoming more... » read more

Week in Review: IoT, Security, Auto


Cybersecurity Check Point Software Technologies reports that facsimile machines (yes, people still use them!) can be subject to hacking through vulnerabilities in their communication protocols. The HP Officejet Pro All-in-One fax printers and other fax machines can be compromised with a hacker only knowing a fax number, according to the company. Check Point Research says a design flaw in Andro... » read more

Week in Review: IoT, Security, Auto


Cybersecurity Jens (Atom) Steube, a cybersecurity researcher and creator of the Hashcat password cracking tool, was probing for vulnerabilities in the new WPA3 security standard for Wi-Fi routers. WPA3 presents a robust defense against hacking, yet Steube discovered a security flaw in routers using WPA/WPA2 – one that leaves Wi-Fi passwords enabled with Pairwise Master Key Identifiers vulner... » read more

Week in Review: IoT, Security, Auto


Automotive Tech Marvell Technology Group opened its automotive electromagnetic compatibility lab in North America. The facility is CISPR 25-qualified and gives the chip company the capability to conduct in-house electrostatic discharge, emission, and immunity testing. Marvell also reported that its 88Q2112 offering received a mark of 100% in conformance testing outlined by the Japan Automotive... » read more

FPGAs Drive Deeper Into Cars


FPGAs are reaching deeper and wider inside of automobiles, playing an increasingly important role across more systems within a vehicle as the electronic content continues to grow. The role of FPGAs in automotive cameras and sensors is already well established. But they also are winning sockets inside of a raft of new technologies, ranging from the AI systems that will become the central logi... » read more

Progress And Chaos On Road To Autonomy


Progress in the development of fully autonomous vehicles is incremental and slow, but not for lack of effort. Research and development in self-driving cars is under way all around the globe, from the biggest automotive manufacturers and their Tier 1 suppliers to companies not traditionally involved in the automotive industry. Add to that fleets of startups working on sensor technologies and ... » read more

Manufacturing Bits: Feb. 6


GaN trusted foundry HRL Laboratories--an R&D venture between Boeing and General Motors--has launched a new foundry service for use in advanced millimeter-wave (mmWave) gallium-nitride (GaN) technology applications. HRL’s process, called T3-GaN, is a high-electron-mobility transistor technology. It will enable the fabrication of GaN-based monolithic microwave integrated circuits (MMICs) fo... » read more

Who’s Responsible For Security?


Semiconductor Engineering sat down to discuss security issues and how to fix them with Mark Schaeffer, senior product marketing manager for secure solutions at Renesas Electronics; Haydn Povey, CTO of Secure Thingz; Marc Canel, vice president of security systems and technologies at [getentity id="22186" comment="Arm"]; Richard Hayton, CTO of Trustonic; Anders Holmberg, director of corporate dev... » read more

Executive Insight: Lip-Bu Tan


Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of [getentity id="22032" e_name="Cadence"], to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools and business. What follows are excerpts of that conversation. SE: What do you see as the next big thing? Tan: Unlike mobility or cell phones, or PCs before th... » read more

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