Week In Review: Auto, Security, Pervasive Computing

GM and GF deal cements GM’s U.S. chip supply chain; most reliable cars; NIST; CWE; Keysight’s European projects.


General Motors (GM) made a deal with GlobalFoundries (GF) to have chips made at the U.S.-based foundry in upstate New York for GM’s key suppliers. GF will expand its production capabilities exclusively for GM’s supply chain, while GM promises to bring economies of scale through its strategy to reduce the unique types of chips needed in products.

J.D. Power released its 2023 U.S. Vehicle Dependability Study (VDS), which says that the automotive industry’s rate of average problems per 100 (PP100) vehicles improved by 6 PP100 over 2022. The industry now is at 186 problems per 100, with infotainment systems being the most problematic. Lexus ranked the highest overall in vehicle dependability at 133 PP100.

Pervasive computing

Sateliot, the company with a 5G NB-IoT nanosatellite constellation, and Sentrisense, a power grid solutions company, have launched 5G satellite connectivity to IoT electric grid sensors. The system will help with monitoring the electric grind.

The operating system (OS) may be going through changes with the advent of artificial intelligence and machine learning. The traditional monolithic OS may no longer be necessary, and a lighter-weight OS may be used in the future.

Synopsys reports that its cloud-based, AI-driven chip-design platform Synopsys DSO.ai (Design Space Optimization AI) has been used in more than 100 tape outs across applications and nodes, starting with an STMicroelectronics tape out.

Keysight’s tools and expertise are being used on four projects that are a part of the 6G Smart Networks and Services Joint Undertaking (SNS-JU), a research and innovation program co-funded by the European Union. The projects are 6G-SANDBOX, for validating new technologies and research advancements for 6G; CENTRIC, 6G networks based on air-interfaces with AI; Imagine-B5G, a 5G platform with network functions and cloud native principles; and 6G SHINE, the main components for short range extreme communications in entities, replacing some wired connections.

Automotive, mobility

Harman Automotive and proteanTecs are working together on predictive and preventive maintenance for automotive electronics combining over the air OTA capability with proteanTecs’ in-chip monitoring and analytics. Harman is a subsidiary of Samsung Electronics.

Ansys expanded its simulation offerings and computer-aided engineering (CAE) tools on Microsoft Azure with Ansys Access on Microsoft Azure, a browser-based connection for customers needing to access high-performance computing during design. Ansys says its work with Microsoft will include digital twins connected to the internet of things, autonomous driving and flying systems development, and the use of simulation data to train artificial intelligence/machine learning (AI/ML) systems.

Infineon Technologies hosted the kick-off meeting of the European research initiative PowerizeD at its headquarters in Munich. The initiative focuses on intelligence in power electronics and how it can contribute to the decarbonization of European society. More than 100 representatives from 39 companies and 23 research institutions attended the meeting.

In EV battery news, new sources for raw materials have come online recently, while the battery materials market is softening from last year’s high.


National Institute of Standards and Technology (NIST) selected a group of lightweight cryptography algorithms called Ascon to keep small devices safe against attack. The algorithms will be published as NIST’s lightweight cryptography standard later in 2023.

Common Hardware Weakness (CWE) update maintained by MITRE, now has CWE Version 4.10 posted on the CWE List page, with one new entry, Dependency on Vulnerable Third-Party Component. Moi400 weakness descriptions to better allow the scope of those CWEs to include hardware; and many updates to the Hardware View and ICS/OT View that are based on contributions by the CWE Hardware SIG and CWE-CAPEC ICS/OT SIG.

The chip industry is starting to add technology that can predict impending failures early enough to stave off serious problems, both in manufacturing and in the field. Engineers increasingly are employing in-circuit monitors embedded in SoC designs to catch device failures earlier in the production flow. But for ICs in the field, data tracing from design to application use only recently has become available, and the methods for tying together that data in useful ways are new. Engineering teams are still figuring out when and how predictive maintenance approaches should be applied to complex electronic systems.

Upcoming Events

  • International Symposium on Field-Programmable Gate Arrays (Monterey, CA), February 12 – 14
  • ISS Europe: Industry Strategy Symposium (Vienna, Austria), February 15 – 16
  • 2023 International Solid-State Circuits Conference — ISSCC 2023, (San Francisco, CA), February 19 – 23
  • Phil Kaufman Award & Banquet, (San Jose, CA), February 23
  • HPCA 2023: IEEE International Symposium on High-Performance Computer Architecture (Montreal, QC, Canada), February 25 – March 1
  • SPIE Advanced Lithography + Patterning (San Jose, CA), February 26 – March 2
  • DVCon U.S. 2023, (San Jose, CA), February 27 – March 2, 2023
  • Conference on Industrial Computed Tomography iCT 23 (Fürth, Germany), February 27 – March 2, 2023

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