Trendspotting: Automotive IC Startup Funding In 2023

By Jesse Allen - 04 Jan, 2024 - Comments: 0

Consumers expect a lot from the electronics in their cars. The parts in the safety-critical systems need to be reliable for up to 18 years, able to handle a range of temperatures, voltages, and vibrations — and all the while be fault-tolerant and make zero errors. On top of those basic requirements, automakers trying to appeal to consumers are adding in more features that communicate with the... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 07 Apr, 2023 - Comments: 0

Automotive, Mobility Tesla employees have been viewing customer videos, according to an investigative report by Reuters. The news outlet surveyed and interviewed Tesla employees, who described using the footage for both legitimate purposes and entertainment purposes within the company. Some employees forwarded videos to coworkers. Even Tesla CEO Elon Musk was not immune. Employees found an in... » read more

Startup Funding: March 2023

By Jesse Allen - 05 Apr, 2023 - Comments: 0

Funding was broadly spread between sectors in March, with automotive edging ahead thanks to a more than $100 million round for a company manufacturing electric, autonomous heavy commercial trucks for freight logistics. To keep up with the amount of information presented by cars and ADAS, several companies raised funds for head-up displays with increasing levels of detail and expanded fields of ... » read more

China Chip Industry Startup Funding Annual Report & Analysis: 2022

By The SE Staff - 21 Mar, 2023 - Comments: 0

China is racing to stay competitive in semiconductors, as trade sanctions increasingly limit its access to EDA tools and manufacturing equipment required for the most advanced manufacturing processes. As a result, state-backed investors and regional development funds are pouring money into domestic semiconductor companies. This report will provide a glimpse into where the money is going, and wh... » read more

Startup Funding: December 2022

By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Startup Funding: May 2022

By Jesse Allen - 06 Jun, 2022 - Comments: 0

May was another strong month for China as it continues its push to build a native semiconductor ecosystem. Over half the month's total funding went to startups in the country. Over half the companies funded were from China as well, including two FPGA companies, three making CPUs, a GPU startup, and numerous networking and wireless chip companies. Two of those, in FPGAs and CPUs, raised rounds s... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer