Globalization And Regionalization Of Knowledge

By Ed Sperling - 29 Jun, 2020 - Comments: 0

Anyone who has clicked on the chat feature on virtual conferences may have noticed the striking mix of nationalities logging in. The explosion of these conferences, as well as video calls, has opened the door for engineers at all levels — from students to industry veterans — to exchange ideas on a global scale. In the past, companies would send a handful of their employees to conferences... » read more

Executive Briefing: Aart de Geus

By Ed Sperling - 27 Sep, 2012 - Comments: 0

By Ann Steffora Mutschler EDA, IP, semiconductors, electronics…actually every industry is woven into the tapestry of a global macroeconomic system. Running a business successfully within this environment requires a unique skillset; at once entrepreneurial as well as wise and discerning. System-Level Design sat down with Aart de Geus, chairman and co-CEO of Synopsys, to discuss these iss... » read more

Vectors of Change

By Ed Sperling - 03 Dec, 2008 - Comments: 0

Downturns have a way of changing things forever—sort of like the earthquake of 1812, which permanently re-routed the Mississippi River in three places. And while the common thinking is that things will go back to where they were before, they never do. For one thing, the trend isn’t just smaller, faster, cheaper. It’s also shorter development cycles. Incredibly complex chips now tak... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: globalization

Globalization And Regionalization Of Knowledge

Executive Briefing: Aart de Geus

Vectors of Change

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Knowledge Centers
Entities, people and technologies explored