Who Owns What And Why

By Ed Sperling - 23 Aug, 2012 - Comments: 0

Who’s calling the shots these days—and how long they’ll continue calling the shots—is turning out to be as much conjecture as playing the futures exchange. There are so many changes underway that even engineers are crossing boundaries no one ever expected and ending up in companies outside of IC design or moving from seemingly far afield into the design world. Still, there are some c... » read more

DSA Moves To R&D Pilot Lines

By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Mark LaPedus Directed self-assembly (DSA), an alternative lithography technology that makes use of block copolymers, is still in the R&D stage for semiconductor production. But as the exotic patterning technology continues to make astounding progress, there are signs the IC industry is accelerating its efforts to bring DSA from the lab to the fab. In fact, DSA suddenly has become a ... » read more

More Design Rules Ahead

By Ed Sperling - 25 Jul, 2012 - Comments: 0

By Ed Sperling & Mark LaPedus For those companies that continue to push the limits of feature shrinkage, designs are about to become more difficult, far more expensive—and much more regulated. Two converging factors will force these changes. First, the limits of current 193nm immersion lithography mean companies now must double pattern at 20nm, and potentially quadruple pattern at 14n... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: gridded design rules

Who Owns What And Why

DSA Moves To R&D Pilot Lines

More Design Rules Ahead