Week In Review: Design, Low Power

By Jesse Allen - 17 Apr, 2020 - Comments: 0

Si2 launched an industry-wide survey to identify planned usage and structural gaps for prioritizing and implementing artificial intelligence and machine learning in EDA. A recently formed Si2 Special Interest Group is conducting the survey as part of an effort to identify where industry collaboration will help eliminate deficiencies caused by a lack of common languages, data models, labels, and... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Apr, 2020 - Comments: 0

COVID-19, IoT Last week, the United States’ Department of Health and Human Service (HHS) announced it will not enforce penalties for certain U.S. HIPAA Rules violations involving COVID-19 testing sites. HIPAA, the Health Insurance Portability and Accountability Act of 1996, protects privacy of health information. Lawyers are looking it over. "Even during the COVID-19 pandemic, providers are ... » read more

Where Is The Edge AI Market And Ecosystem Headed?

By Geoff Tate - 05 Dec, 2019 - Comments: 1

Until recently, most AI was in datacenters and most was training. Things are changing quickly. Projections are AI sales will grow rapidly to $10s of billions by the mid 2020s, with most of the growth in Edge AI Inference. Edge inference applications Where is the Edge Inference market today? Let’s look at the markets from highest throughput to lowest. Edge Servers Recently Nvidia annou... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Groq

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Where Is The Edge AI Market And Ecosystem Headed?