Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 02 Jul, 2021 - Comments: 0

Security The U.S. government agencies put out a warning that Russian military has been using a Kubernetes cluster to attempt distributed and anonymized brute force access against hundreds of government and private sector targets worldwide. Department of Homeland Security (DHS)’s Cybersecurity and Infrastructure Security Agency (CISA), the Federal Bureau of Investigation (FBI), the National S... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 25 Jan, 2019 - Comments: 0

Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 06 Jan, 2017 - Comments: 0

Chipmakers and OEMs Samsung NEXT, formerly called the Samsung Global Innovation Center, has announced the creation of the Samsung NEXT Fund, a $150 million venture capital investment fund. The idea is to fund early stage startups. What’s next in consumer electronics? At CES 2017, Samsung unveiled a wide range of new products, such as quantum dot TVs, smart appliances, gaming laptops and s... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week In Review: Auto, Security, Pervasive Computing

Week in Review: IoT, Security, Auto

The Week In Review: Manufacturing