tag: heterogenous integration

Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced Packaging Technology
By Lihong Cao - 23 Jan, 2025 - Comments: 0

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional monolithic system-on... » read more

Advancing Medical Devices Through Heterogeneous Integration
By David Fromm - 23 Jan, 2025 - Comments: 0

As medical treatments continue to evolve, innovation in medical devices plays a vital role, enabling increasingly complex, precise, and safer interventions. For example: Endoscopic devices provide high-resolution in vivo imaging, Wearable sensors offer real-time monitoring of vital signs, Implantable devices engage with the human body at the cellular level. These devices’ ongo... » read more

Design And Verification Issues In 2024
By Brian Bailey - 19 Dec, 2024 - Comments: 0

At the end of each year, I look back over the stories published and those that top the charts in terms of readership. I concentrate on those stories that are about the EDA tools and flows and the factors that are influencing them. These are good indicators of the problems designers and verification teams are facing today, and where they are looking for answers. This year's leading categories... » read more

Heterogenous Integration Expertise for Sensors and MEMS Packaging and Assembly
By Promex Industries - 18 Dec, 2024 - Comments: 0

Sensors and microelectromechanical systems (MEMS) are unlocking new design possibilities for miniature devices used in healthcare, smart systems, consumer electronics, and more. Designers need a partner experienced with Heterogenous Integration (HI) to assemble the unique components for these devices and address the complications of these integrations. In this white paper, you will learn: ... » read more

Accelerating The AI Economy Through Heterogeneous Integration
By Yin Chang - 17 Dec, 2024 - Comments: 0

The world is rapidly transitioning from an internet economy to an AI economy. In the internet economy, we stayed constantly connected to the internet 24/7 through our smartphones, PCs, and IoT devices. However, in the AI economy, every aspect of our lives is interwoven with artificial intelligence. You may already be familiar with AI tools such as ChatGPT or Google Gemini, which answer question... » read more

Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
By Jeorge Hurtarte - 15 Oct, 2024 - Comments: 0

Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The automated test equipment (ATE) industry is responding, developing and utilizing more sophisticated test equipment capable of handling the diverse functionalities and interfaces needed to test heterogeneous... » read more

Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity
By Michael Walsh - 25 Jul, 2024 - Comments: 0

By Michael Walsh and Jin Hou with Todd Burkholder The heterogeneous integration of multiple ICs in a single package along with high-performance, high-bandwidth memory is critical for many high-performance computing applications. After everything has been heterogeneously integrated and packaged, such designs feature complex connectivity with many hundreds of thousands of connections, making i... » read more

Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging
By Heejun Jang - 23 Jul, 2024 - Comments: 0

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of high-performance computing (HPC) applications is growing rapidly [2]. And, the HPC market requires high processing speed, fast network clusters and large parallel computing. To meet the market requirement... » read more

Advanced Packaging Design For Heterogeneous Integration
By CP Hung - 18 Apr, 2024 - Comments: 0

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, edge AI and autonomous electrical vehicles, traditional chips are transforming i... » read more

The City In The Tower: 3D ICs Transform The Electronics System Landscape
By Keith Felton - 14 Mar, 2024 - Comments: 0

By Keith Felton and Todd Burkholder The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect a watershed in the nature of electronics products that can be designed and manufactured. Yet again—as with personal computers, the internet, and smart phones—our increasingly digital world will never be the same. 3D IC architectures... » read more

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