tag: heterogenous integration

Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
By Vincent Lin - 20 Feb, 2025 - Comments: 0

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as a crucial solution for alleviating bandwidth bottlenecks. Tod... » read more

Developing Systems For Heterogeneous Integration: Insights From HiCONNECTS
By Kartikey Srivistava - 20 Feb, 2025 - Comments: 0

The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor manufacturing market share to 20% by 2030, collaboration across the value chain is imperative. Heterogeneous Integration for Connectivity and Sustainability (HiCONNECTS), a Horizon Europe-funde... » read more

Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced Packaging Technology
By Lihong Cao - 23 Jan, 2025 - Comments: 0

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional monolithic system-on... » read more

Advancing Medical Devices Through Heterogeneous Integration
By David Fromm - 23 Jan, 2025 - Comments: 0

As medical treatments continue to evolve, innovation in medical devices plays a vital role, enabling increasingly complex, precise, and safer interventions. For example: Endoscopic devices provide high-resolution in vivo imaging, Wearable sensors offer real-time monitoring of vital signs, Implantable devices engage with the human body at the cellular level. These devices’ ongo... » read more

Design And Verification Issues In 2024
By Brian Bailey - 19 Dec, 2024 - Comments: 0

At the end of each year, I look back over the stories published and those that top the charts in terms of readership. I concentrate on those stories that are about the EDA tools and flows and the factors that are influencing them. These are good indicators of the problems designers and verification teams are facing today, and where they are looking for answers. This year's leading categories... » read more

Heterogenous Integration Expertise for Sensors and MEMS Packaging and Assembly
By Promex Industries - 18 Dec, 2024 - Comments: 0

Sensors and microelectromechanical systems (MEMS) are unlocking new design possibilities for miniature devices used in healthcare, smart systems, consumer electronics, and more. Designers need a partner experienced with Heterogenous Integration (HI) to assemble the unique components for these devices and address the complications of these integrations. In this white paper, you will learn: ... » read more

Accelerating The AI Economy Through Heterogeneous Integration
By Yin Chang - 17 Dec, 2024 - Comments: 0

The world is rapidly transitioning from an internet economy to an AI economy. In the internet economy, we stayed constantly connected to the internet 24/7 through our smartphones, PCs, and IoT devices. However, in the AI economy, every aspect of our lives is interwoven with artificial intelligence. You may already be familiar with AI tools such as ChatGPT or Google Gemini, which answer question... » read more

Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
By Jeorge Hurtarte - 15 Oct, 2024 - Comments: 0

Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The automated test equipment (ATE) industry is responding, developing and utilizing more sophisticated test equipment capable of handling the diverse functionalities and interfaces needed to test heterogeneous... » read more

Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity
By Michael Walsh - 25 Jul, 2024 - Comments: 0

By Michael Walsh and Jin Hou with Todd Burkholder The heterogeneous integration of multiple ICs in a single package along with high-performance, high-bandwidth memory is critical for many high-performance computing applications. After everything has been heterogeneously integrated and packaged, such designs feature complex connectivity with many hundreds of thousands of connections, making i... » read more

Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging
By Heejun Jang - 23 Jul, 2024 - Comments: 0

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of high-performance computing (HPC) applications is growing rapidly [2]. And, the HPC market requires high processing speed, fast network clusters and large parallel computing. To meet the market requirement... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy