Manufacturing Bits: Dec. 23

By Mark LaPedus - 23 Dec, 2014 - Comments: 0

Higgs boson sensors At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, CERN described the tiny hybrid pixel detectors used at the Large Hadron Collider (LHC). Using CMOS technology, hybrid pixel detectors identify and tag individual sub-atomic particles at fast speeds. CERN, the European Organization for Nuclear Research, is a particle physics laboratory... » read more

Expert on Expert: The Higgs Boson

By Ed Sperling - 30 Sep, 2013 - Comments: 0

Mentor Graphics CEO Wally Rhines, a materials scientist, talks with Dr. Sean Carroll, a particle physicist at the California Institute of Technology about the discovery of the Higgs Boson, the cost of future discoveries, and what's left for physicists to discover. [youtube vid=qokwittw_8k] » read more

Boson Hunting

By Ed Sperling - 20 Sep, 2013 - Comments: 0

By Ed Sperling It’s not the “God particle” or anything even remotely connected to the formation of the universe. But in particle physics, the powerful forces that keep the tiny particles in an atom confined to a very small space are now coming into much better focus. [caption id="attachment_5772" align="alignnone" width="640"] Source: Cern.ch[/caption] The reason is a combination o... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Higgs Boson

Manufacturing Bits: Dec. 23

Expert on Expert: The Higgs Boson

Boson Hunting