Week in Review – IoT, Security, Autos

By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

April’19 Startup Funding: Corporate Gushers

By Jeff Dorsch - 02 May, 2019 - Comments: 0

It was another rich month for startups, large and small. In April’s top 11 funding rounds, five were investments by big corporations or corporate venture capital funds—an investor consortium led by the SoftBank Vision Fund, PayPal, Ford Motor, NTT DoCoMo, and HAPSMobile, a joint venture of SoftBank Group and AeroVironment. Those 11 investments totaled $3.74 billion. Intel Capital was als... » read more

The Week in Review: IoT

By Jeff Dorsch - 13 Apr, 2018 - Comments: 0

Finance Palo Alto, Calif.-based Armis raised $30 million in Series B funding, bringing total funding for the provider of enterprise Internet of Things security to $47 million. Red Dot Capital Partners of Israel led the round, joined by Bain Capital Ventures. Existing investors Sequoia Capital and Tenaya Capital also participated in the latest funding, which Armis will use to expand sales and m... » read more

Chip Startup Shuts Its Doors

By Mark LaPedus - 19 Dec, 2013 - Comments: 0

Calxeda, a high-profile developer of ARM-based chips for servers and other products, has shut its doors and effectively ceased operations. As part of the move, the startup has laid off nearly all of its 130 employees amid what it calls a restructuring period. Founded in 2008, Calxeda has raised around $103 million in funding, and has been selling ARM-based server chips in an emerging but inc... » read more

Knowledge Centers
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by Ann Mutschler

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by Ed Sperling

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The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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tag: Highland Capital Partners

Week in Review – IoT, Security, Autos

April’19 Startup Funding: Corporate Gushers

The Week in Review: IoT

Chip Startup Shuts Its Doors

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