Week In Review: Design, Low Power

By Jesse Allen - 26 Jul, 2019 - Comments: 0

CEVA acquired the Hillcrest Labs business from InterDigital. Hillcrest Labs supplies software and components for sensor processing in consumer and IoT devices. Hillcrest Labs' MotionEngine sensor processing software already runs on CEVA DSPs (as well as ARM and RISC-V cores) and enables high accuracy 6-axis and 9-axis sensor fusion, dynamic sensor calibration, and application specific features ... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 26 Jul, 2019 - Comments: 0

Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Solving ‘Simulator Sickness’ With Smart Software, SoC Design

By Brian Fuller - 14 Jan, 2016 - Comments: 0

The growth in virtual and augmented reality headsets is expected to explode in the coming years. The U.K.-based research firm KZero estimates headset unit volume will jump from nearly 4 million this year to 38.4 million in 2018. But that growth rate might be stunted if users continue to struggle with “simulator sickness,” that queasy feeling that something is just not right as they navi... » read more

The Week In Review: Design/IoT

By Jesse Allen - 27 Feb, 2015 - Comments: 0

Mergers & Acquisitions NXP acquired Quintic’s Bluetooth Low Energy and Wearable businesses, adding BLTE to their low power RF-connectivity portfolio. The team of approximately 65 is expected to join NXP when the deal closes in Q1 2015. Tools Cadence unveiled the integration of Forte's Cynthesizer with their own C-to-Silicon Compiler. The result is the Stratus high-level synthesis... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Hillcrest Labs

Week In Review: Design, Low Power

Week in Review: IoT, Security, Autos

Solving ‘Simulator Sickness’ With Smart Software, SoC Design

The Week In Review: Design/IoT

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