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Aging In Advanced Nodes


Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; Magdy Abadir, vice president of marketing at ... » read more

Using More Verification Cores


Semiconductor Engineering sat down to talk about parallelization efforts within EDA with Andrea Casotto, chief scientist for Altair; Adam Sherer, product management group director in the System & Verification Group of Cadence; Harry Foster, chief scientist for Mentor, a Siemens Business; Vladislav Palfy, global manager for applications engineering at OneSpin; Vigyan Singhal, chief Oski for ... » read more

Verification Trends Enabling A 5G Future


Applications have driven requirements for verification for quite some time now, as I have written previously regarding Aero & Defense, AI and Machine Learning and the Internet of Things. In wireless communication, we are just at the brink of the transition to Fifth Generation Networks, or 5G. This transition will not only lead to new applications and use models that will impact our day-to-d... » read more

Week In Review: Design, Low Power


Achronix and Mentor uncorked an optimized HLS flow for Achronix's FPGA technology products. The integrated development environment enables designers to quickly go from C++ to FPGA using Mentor's Catapult HLS and Achronix's ACE design tools. Initially used for 5G wireless applications to reduce the overall development effort and improve QoR, it is suitable for any design targeting Achronix techn... » read more

Toward A 5G, AI-Centric World


The market environment over the coming years will continue to experience an explosion of data generation from a variety of new sources such as smart cars, smart factories, smart hospitals and smart network infrastructure. Data explosion combined with artificial intelligence (AI) will create a renaissance of computing and storage hardware. Mobile World Congress 2018 (MWC) reinforced this market ... » read more

Cheaper Packaging Options Ahead


Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

The Week In Review: Manufacturing


Chipmakers Semiconductor IP startup eVaderis has demonstrated a design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor’s BA2X product line. The software, system and memory IP developed by eVaderis make Beyond Semiconductor’s new MCU ideally suited for battery-powered applications in IoT and wearable electronics. By incorporating the latest STT-MRAM tec... » read more

The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week In Review: Design


IP Cryptographic flaws have been discovered in the IEEE P1735 standard for encrypting IP and managing access rights. A team from the University of Florida found "a surprising number of cryptographic mistakes in the standard. In the most egregious cases, these mistakes enable attack vectors that allow us to recover the entire underlying plaintext IP." The researchers warn that an adversary coul... » read more

The Week In Review: Manufacturing


Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

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