Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 20 Mar, 2020 - Comments: 0

National Instruments is offering free online training courses to anyone anywhere, until the end of April to help support the engineering community during COVID-19 crisis. Some instructor-led virtual training is available at reduced cost. NIWeek has been postponed this year until August 3-5, 2020. Click here for more news about how the semiconductor industry is handling COVID-19. AI, machi... » read more

Europe’s New R&D Program

By Emir Demircan - 15 Feb, 2018 - Comments: 0

European Union (EU) research, development and innovation programs have proved successful in recent decades. The current framework program (FP) Horizon 2020, with its 80 billion EUR total budget – around 17 billion EUR of which is allocated for Industrial Leadership – has produced unparalleled collaboration opportunities that no single European country can match on its own. FPs are strate... » read more

Semiconductor R&D Crisis?

By Mark LaPedus - 11 Jun, 2015 - Comments: 3

Research and development is a sometimes forgotten but critical element in the semiconductor industry. The delicate R&D ecosystem enables many of the key breakthroughs in the business. But there could be a troubling trend, if not a crisis, brewing on two fronts in the R&D arena. On one front, R&D costs for semiconductor technologies are escalating at each node. Higher R&D costs are not only ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Horizon 2020

Week In Review: Auto, Security, Pervasive Computing

Europe’s New R&D Program

Semiconductor R&D Crisis?