Thermoelectric Active Cooling Hot Spots in Chips


A technical paper titled “Thermoelectric active cooling for transient hot spots in microprocessors” was published by researchers at the University of Pittsburgh and Carnegie Mellon University. Abstract: "Modern microprocessor performance is limited by local hot spots induced at high frequency by busy integrated circuit elements such as the clock generator. Locally embedded thermoelectric ... » read more

Finding Hotspots In AI Chips


Things are getting far more complicated as we move down to 7nm & 5nm but the tolerances of some of the physical effects that we have been measuring in the past are much tighter than they were at the older nodes. How do we track all that? What we see is that as we descend through the advanced nodes, say from 16nm down to 12nm, 7nm and more recently 5nm, we see that gate density starts to ... » read more

Power/Performance Bits: Sept. 25


Heat transfer in 2D materials Engineers at the University of Illinois developed a way to reduce overheating in nanoelectronics that incorporate 2D components by adding another layer to the structure. "In the field of nanoelectronics, the poor heat dissipation of 2D materials has been a bottleneck to fully realizing their potential in enabling the manufacture of ever-smaller electronics whil... » read more