Moore’s Law, Supply Chains And Security


The debate about the future of Moore's Law continues, while other parts of the industry look for alternatives. In between, supply chains are being pulled in multiple directions, with safety and security often in the middle. All across the semiconductor industry, significant changes are underway. Some of these have been in the works for some time. Others are new or accelerating faster than an... » read more

EDA, IP Growth Surge


EDA and IP grew 8.9% in Q3 of 2019, according to a just-released report, indicating continued confidence in semiconductor growth. Total revenue was up 8.9% globally compared with the same period in 2018, but that number is deceptively low. Revenue in China, for example, increased 5.7% compared to the same quarter in 2018, despite trade restrictions on sales of any IP developed in the United ... » read more

What Worked, What Didn’t In 2019


2019 has been a tough year for semiconductor companies from a revenue standpoint, especially for memory companies. On the other hand, the EDA industry has seen another robust growth year. A significant portion of this disparity can be attributed to the number of emerging technology areas for semiconductors, none of which has reached volume production yet. Some markets continue to struggle, a... » read more

Week In Review: IoT, Security, Auto


Internet of Things SiFive is bringing RISC-V to IoT makers and university developers through the RISC-V-based SiFive Learn Initiative, an open-source learning package that can be used to create a low-cost RISC-V hardware compatible with AWS IoT Core. The development platform SiFive Learn Inventor has a software package and education enablement course. It includes: The programmable SiFive Lear... » read more

Week In Review: IoT, Security, Automotive


Automotive Porsche’s electric race car, the 99X Electric, used ANSYS Technology’s system-level simulation solutions to create an advanced electric powertrain. The powertrain is also being adapted for use in Porsche’s consumer electric cars. "ANSYS system-level simulations are instrumental for optimizing the Porsche E-Performance Powertrain's motor, gearbox, power electronics and control ... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Week In Review: Manufacturing, Test


Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

Week In Review: Manufacturing, Test


Chipmakers The IC industry once had several leading-edge vendors that invested and built new fabs. But over time, the field has narrowed due to soaring costs and a dwindling customer base. In 1994, the share of semiconductor industry capital spending held by the top five companies was 25%, according to IC Insights. This meant that a number of companies invested and built new fabs during the... » read more

Week In Review: Manufacturing, Test


Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Week In Review: Manufacturing, Test


Chipmakers In its latest move to cut costs and focus on its core business, GlobalFoundries (GF) has announced plans to jettison its U.S. photomask operations in Burlington, Vt., but the foundry vendor will maintain a stake in its joint venture mask unit. Under the plan, Toppan Photomasks will acquire certain assets of GF’s Burlington photomask facility. “GF is transferring its mask tool... » read more

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