Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Automaker Toyota and Texas-based electricity distributor Oncor Electric Delivery (Oncor) are embarking on a vehicle-to-grid (V2G) pilot project to explore the feasibility of transferring energy from BEVs’ batteries back to the grid. Toyota and Oncor want to better understand the interconnectivity between BEVs and utilities. The project will start testing at Oncor’s res... » read more

Week In Review: Semiconductor Manufacturing, Test


With the European Council’s adoption of its negotiating mandate for the European Chips Act, member states and the Czech Presidency of the Council have reached a critical milestone in supporting Europe’s efforts to advance manufacturing and supply of critical components, while bolstering R&D capacities for development of next-generation semiconductor innovations, according to SEMI. Ch... » read more

Challenges Mount In New Autos


Electronics are becoming the primary differentiator for carmakers, adding an array of options that can alter everything from how a vehicle's occupants interact with their surroundings to how the vehicle drives. But the infrastructure needed to support these features also raises a slew of technology and business questions for which there are no simple answers today. For example, how will new ... » read more

New Uses For AI In Chips


Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Chips Can Boost Malware Immunity


Security is becoming an increasingly important design element, fueled by increasingly sophisticated attacks, the growing use of technology in safety-critical applications, and the rising value of data nearly everywhere. Hackers can unlock automobiles, phones, and smart locks by exploiting system design soft spots. They even can hack some mobile phones through always-on circuits when they are... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Speeding Up Scan-Based Volume Diagnosis


In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

Adaptive NN-Based Root Cause Analysis in Volume Diagnosis for Yield Improvement


Abstract "Root Cause Analysis (RCA) is a critical technology for yield improvement in integrated circuit manufacture. Traditional RCA prefers unsupervised algorithms such as Expectation Maximization based on Bayesian models. However, these methods are severely limited by the weak predictive capability of statistical models and can’t effectively transfer the yield learning experience from old... » read more

China Accelerates Foundry, Power Semi Efforts


China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

System-In-Package Thrives In The Shadows


IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

← Older posts Newer posts →