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High-throughput LHSI Reflectometry Technique For ICU and IWU Measurements of Semiconductor Devices


New technical paper titled "Toward realization of high-throughput hyperspectral imaging technique for semiconductor device metrology," from researchers at Samsung Electronics Co. Abstract "Background: High-throughput three-dimensional metrology techniques for monitoring in-wafer uniformity (IWU) and in-cell uniformity (ICU) are critical for enhancing the yield of modern semiconductor manu... » read more