Designing For Multiple Die

Integrating multiple die or chiplets into a package is proving to be very different than putting them on the same die, where everything is developed at the same node using the same foundry process. As designs become more heterogeneous and disaggregated, they need to be modeled, properly floor-planned, verified, and debugged in the context of a system, rather than as individual components. Typi... » read more

FPGA Prototyping Complexity Rising

Multi-FPGA prototyping of ASIC and SoC designs allows verification teams to achieve the highest clock rates among emulation techniques, but setting up the design for prototyping is complicated and challenging. This is where machine learning and other new approaches are beginning to help. The underlying problem is that designs are becoming so large and complex that they have to be partitioned... » read more