Anything As A Service

By Ernest Worthman - 03 Dec, 2015 - Comments: 0

Everything as a service promises to simplify our lives, from cutting edge business to consumer applications. It is too early to tell, but the concept of everything moving to the cloud poses some interesting issues, from bandwidth to security. Who would have guessed that in 2015, launching a business would require virtually no physical assets? You simply turn on your computer and everything y... » read more

IaaS vs. SaaS

By Ed Sperling - 24 May, 2012 - Comments: 0

By Ann Steffora Mutschler There has been a lot of confusion about what kind of cloud-based service the EDA industry offers. Here are two different business models. Infrastructure as a service (IaaS) In this most basic cloud service model, cloud providers offer computers – as physical or more often as virtual machines, raw (block) storage, firewalls , load balancers, and networks. IaaS pr... » read more

EDA’s Cloudy Vision

By Ed Sperling - 24 May, 2012 - Comments: 0

By Ann Steffora Mutschler Since the dawn of EDA, the industry has largely operated under a traditional software distribution model whereby the customer would run the software it licensed on its own hardware equipment. With the sophistication of advanced IT management techniques as well as education surrounding “The Cloud,” it may be safe to predict that engineers in the not-to-distant futu... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: IaaS

Anything As A Service

IaaS vs. SaaS

EDA’s Cloudy Vision