Week In Review: Manufacturing, Design, Test

By Mark LaPedus - 07 Feb, 2014 - Comments: 0

This is no surprise, but it could be the end of an era. IBM is exploring a sale of its semiconductor business, according to FT.com. A survey, conducted by Harris Interactive on behalf of Crucial.com, revealed that when asked to choose between these two specific types of men, 84% of women who prefer to be involved with men prefer their male love interest to be "super handy" with computers an... » read more

Manufacturing Bits: Feb. 4

By Mark LaPedus - 04 Feb, 2014 - Comments: 0

Secrets of mass variation The General Conference on Weights and Measures will soon approve a plan to redefine the kilogram and other measurement units. The new definition for the kilogram will be based on the fixed numerical values of Planck’s constant (h). Supposedly, the new definition will solve the current problem. The kilogram is the only SI unit that is still described as an artif... » read more

Week In Review: Manufacturing, Design, Test

By Mark LaPedus - 31 Jan, 2014 - Comments: 0

The technology of 3D "bioprinting" (the medical application of 3D printing to produce living tissue and organs) is advancing so quickly that it will spark a major ethical debate on its use by 2016, according to Gartner. At the same time, 3D printing of non-living medical devices such as prosthetic limbs, combined with a burgeoning population and insufficient levels of healthcare in emerging mar... » read more

A Perspective On Open Process Specification

By Ted Paone - 27 Jan, 2014 - Comments: 2

It is the job of the Process Design Kit (PDK) engineers to deliver a high-quality PDK that properly represents the process requirements and constraints and supports the design flows used by their customers. The PDK engineer takes multiple inputs describing the process and the devices and circuitry in the process and generates the output in the form of OpenAccess technology libraries (techDB), d... » read more

What’s After CMOS?

By Mark LaPedus - 24 Jan, 2014 - Comments: 3

Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor could scale at least to the 3nm node in the 2021 timeframe. And then, CMOS could run out of gas, prompting the need for a new switch technology. So what’s after the CMOS-based transistor? Carbon nanotubes and graphene get the most a... » read more

The Week In Review: System-Level Design

By Ed Sperling - 24 Jan, 2014 - Comments: 0

India's reliance on technology has created a huge demand for software in the country. IDC expects the market for enterprise software in India to grow 19%, and the market for collaborative applications to grow 13.5%. Growth is continuing across all business markets, turning India into a huge consumer of software rather than just a creator. The enterprise software market in India is dominated by ... » read more

Defining The Next Standard Cell

By The SE Staff - 22 Jan, 2014 - Comments: 1

Synopsys, Intel and IBM all contributed technology to Si2 to create a standard version of parameterized cells, or PCells, for mixed-signal designs. The move is an attempt to smooth out design incompatibilities using Synopsys and Cadence technology. Cadence is the clear market leader in this space. But as more technology is developed using different vendors' tools for integration in complex... » read more

What’s After Silicon?

By Katherine Derbyshire - 09 Jan, 2014 - Comments: 4

As discussed in the first article in this series, germanium is one of the leading candidates to succeed silicon as the channel material for advanced transistors, and has been for several years. The fundamental challenges of germanium integration were detailed at length in 2007. Unfortunately, knowing what the issues are does not necessarily lead to a solution. When a MOSFET transistor turns ... » read more

Manufacturing Bits: Jan. 7

By Mark LaPedus - 07 Jan, 2014 - Comments: 0

Climbing Terminator Robots Simon Fraser University has developed a family of climbing robots that mimic the stickiness of gecko lizard feet. Based on a “footpad terminator” adhesive technology, the robots could be used in space missions and on Earth. The climbing robot, called Abigaille, features six legs. This allows the robots to crawl on vertical and horizontal structures. The techno... » read more

The Week In Review: System-Level Design

By Ed Sperling - 03 Jan, 2014 - Comments: 0

The big buzz at this year’s CES is around wearable computing, according to Gartner, and the big drivers will be fitness and digital health. The firm believes wearable electronics will be peripherals to smartphones, which will provide connectivity to store and analyze biodata. Hewlett-Packard plans to cut 34,000 employees by the end of this year, or roughly 11% of its workforce, according t... » read more

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Knowledge Centers
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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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tag: IBM

Week In Review: Manufacturing, Design, Test

Manufacturing Bits: Feb. 4

Week In Review: Manufacturing, Design, Test

A Perspective On Open Process Specification

What’s After CMOS?

The Week In Review: System-Level Design

Defining The Next Standard Cell

What’s After Silicon?

Manufacturing Bits: Jan. 7

The Week In Review: System-Level Design