Impact Of U.S.-China Trade War

By Mark LaPedus - 23 May, 2019 - Comments: 0

The trade war between the United States and China is escalating and it is here to stay. Last year, the Trump administration started the trade war with China for basically two reasons. First, China has a massive trade surplus with the U.S. Second, U.S. companies have been the subject of IP theft in China, which has largely gone unchecked, according to the Trump administration. Many disagre... » read more

Controlling IC Manufacturing Processes For Yield

By Ed Sperling - 24 Apr, 2019 - Comments: 0

Equipment and tools vendors are starting to focus on data as a means of improving yield, adding more sensors and analysis capabilities into the manufacturing flow to circumvent problems in real time. How much this will impact the cost of developing complex chips at leading-edge nodes, and in 2.5D and 3D-IC packages, remains to be seen. But the race to both generate data during manufacturing ... » read more

What’s the Right Path For Scaling?

By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Foundries Prepare For Battle At 22nm

By Mark LaPedus - 19 Nov, 2018 - Comments: 0

After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

The Chiplet Race Begins

By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Can A Supply Chain Be Too Efficient?

By Ed Sperling - 20 Jul, 2017 - Comments: 0

The semiconductor industry is a model of efficiency—literally. When other industries look at adding smart manufacturing into their operations, they often look to chip manufacturing as a shining example. After decades of business gyrations, semiconductor companies have figured out how to instill efficiency into every aspect of making chips. This is evident in device scaling. At 90nm, the co... » read more

The Race To 10/7nm

By Mark LaPedus - 22 May, 2017 - Comments: 4

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

22nm Process War Begins

By Mark LaPedus - 23 Apr, 2017 - Comments: 1

Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

Manufacturing Bits: April 7

By Mark LaPedus - 07 Apr, 2015 - Comments: 0

Liquid metal for Terminator robots The Chinese Academy of Sciences and Tsinghua University have devised a robot-like, self-fueled liquid metal mollusk. The liquid metal alloy within the system can move by itself and change form like the shape-shifting T-1000 robot in the movie Terminator 2: Judgment Day. The system consists of a liquid metal motor. The liquid metal is a mix of gallium, i... » read more

How Much Will That Chip Cost?

By Ed Sperling - 27 Mar, 2014 - Comments: 1

From the most advanced process nodes to the trailing edge of design there is talk about the skyrocketing cost of developing increasingly complex SoCs. At 16/14nm it’s a combination of multi-patterning, multiple power domains and factoring in physical and proximity effects. At older nodes, it’s the shift to more sophisticated versions of the processes and new tools to work within those proce... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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