tag: imec

Chip Industry Week In Review
By The SE Staff - 20 Sep, 2024 - Comments: 0

Synopsys agreed to sell its Optical Solutions Group to Keysight for an undisclosed amount, in a deal deemed necessary for Synopsys to win regulatory approval for its planned acquisition of Ansys. The sale to Keysight is contingent on the Synopsys-Ansys deal going through. Meanwhile, Ansys has its own optical business. The U.S. Department of Defense (DoD) made the first awards for Microelectr... » read more

Chip Industry Technical Paper Roundup: Sept. 9
By Linda Christensen - 09 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=354 /] More ReadingTechnical Paper Library home » read more

Fano Resonance in a Si PIC Using a Piezoelectrically Driven Mechanism (Ghent, imec)
By Technical Paper Link - 06 Sep, 2024 - Comments: 0

A new technical paper titled "Piezoelectrically driven Fano resonance in silicon photonics" was published by researchers at Ghent University and imec. Abstract "Piezoelectric optomechanical platforms provide a promising avenue for efficient signal transduction between microwave and optical domains. Lead zirconate titanate (PZT) thin film stands out as a compelling choice for building such... » read more

Chip Industry Technical Paper Roundup: Sept. 3
By Linda Christensen - 03 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=256 /] More ReadingTechnical Paper Library home » read more

Benefits Of The Ultra-Low Leakage Currents from IGZO TFTs For Neuromorphic Applications
By Technical Paper Link - 27 Aug, 2024 - Comments: 0

A new technical paper titled "A tunable multi-timescale Indium-Gallium-Zinc-Oxide thin-film transistor neuron towards hybrid solutions for spiking neuromorphic applications" was published by researchers at imec, CSIC Universidad de Sevilla, and Sungkyunkwan University. Abstract "Spiking neural network algorithms require fine-tuned neuromorphic hardware to increase their effectiveness. Such ... » read more

Buried Si/SiGe Interfaces Investigated Using Soft X-Ray Reflectometry and STEM-EDX
By Technical Paper Link - 27 Aug, 2024 - Comments: 0

A new technical paper titled "Interface sharpness in stacked thin film structures: a comparison of soft X-ray reflectometry and transmission electron microscopy" was published by researchers at Physikalisch-Technische Bundesanstalt (PTB), imec, and Thermo Fisher Scientific Inc. The paper states: "A key element of semiconductor fabrication is the precise deposition of thin films. Among other... » read more

Chip Industry Week In Review
By The SE Staff - 16 Aug, 2024 - Comments: 0

The U.S. Department of Commerce and Texas Instruments (TI) signed a non-binding preliminary memorandum of terms to provide up to $1.6 billion in CHIPS Act funding towards TI’s investment of over $18 billion for three 300mm semiconductor wafer fabs under construction in Texas and Utah. TI also expects to get about $6 billion to $8 billion from the U.S. Department of Treasury’s Investmen... » read more

Reasons To Know IGZO
By Katherine Derbyshire - 15 Aug, 2024 - Comments: 0

Interest in monolithic 3D integration is driven by both compute-in-memory applications and a more general need for increased circuit density. Compute-in-memory architectures seek to reduce the power requirements of machine learning workloads, which are dominated by the movement of data between memory and logic components. Even in conventional architectures, though, placing high-density, high-ba... » read more

Chip Industry Technical Paper Roundup: August 13
By Linda Christensen - 13 Aug, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=249 /] More ReadingTechnical Paper Library home   » read more

Chip Industry Week In Review
By The SE Staff - 09 Aug, 2024 - Comments: 0

Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

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