Board-Level Packaging Method For Device Encapsulation To Enable Water Immersion Cooling


A new technical paper titled "Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling" was published by researchers at University of Illinois, Urbana, University of Arkansas and UC Berkeley. Abstract "Power densification is making thermal design a key step in the development of future electrical devices. Systems such as data centers and electric vehicl... » read more

Is Liquid Cooling Right for Your Data Center: eBook


As data centers face rising chip densities and energy costs, liquid cooling is emerging as a powerful solution. But is it the right fit for your facility? This eBook covers the essentials to help you decide. Who Should Read This eBook: -Senior management of data center operations -Data center designers and consultants -Engineers in IT and facilities management Key Takeaways: -Lear... » read more

Research Bits: June 20


Quantum takes a Helium 3 bath A team of researchers from National Physical Laboratory, Royal Holloway University of London, Chalmers University of Technology, and Google have found that immersing superconducting quantum circuits in a bath of Helium-3 (3He) can cool down quantum circuits to almost 100 times lower than was possible before, to achieve under a thousand of a degree above absolute z... » read more

Thermal Management Implications For Heterogeneous Integrated Packaging


As the semiconductor industry reaches lower process nodes, silicon designers struggle to have Moore's Law produce the results achieved in earlier generations. Increasing the die size in a monolithic system on chip (SoC) designs is no longer economically viable. The breakdown of monolithic SoCs into specialized chips, referred to as chiplets, presents significant benefits in terms of cost, yield... » read more