Manufacturing Bits: Oct. 20

By Mark LaPedus - 20 Oct, 2015 - Comments: 0

Singapore opens R&D center The Agency for Science, Technology and Research (A*STAR) has officially opened its new R&D center in Singapore. The center, dubbed Fusionopolis Two, is a $450 million facility, according to Singapore’s A*STAR. It will provide the industry with co-location opportunities for R&D. Anchored at Fusionopolis Two are the following A*STAR research institutes: th... » read more

Manufacturing Bits: May 19

By Mark LaPedus - 19 May, 2015 - Comments: 0

Self-steering bullets DARPA has completed the development of a self-steering bullet that increases the hit rate for long-distance shots. The effort, dubbed the Extreme Accuracy Tasked Ordnance (EXACTO) program, is aimed for military snipers. The technology combines a maneuverable bullet and a real-time guidance system to track and deliver the projectile to the target, according to DARPA. It... » read more

Manufacturing Bits: Oct. 1

By Mark LaPedus - 01 Oct, 2013 - Comments: 0

Nanoimprint Foundry Singapore’s A*STAR’s Institute of Materials Research and Engineering (IMRE) and its partners have launched a new R&D foundry using nanoimprint lithography. The so-called Nanoimprint Foundry is a collaboration between several entities, such as IMRE, Toshiba Machines, EV Group, NTT, NIL Technology, Kyodo International, Micro Resist Technology, Nanoveu and Solves In... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: IMRE

Manufacturing Bits: Oct. 20

Manufacturing Bits: May 19

Manufacturing Bits: Oct. 1

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Entities, people and technologies explored