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Tradeoffs To Improve Performance, Lower Power


Generic chips are no longer acceptable in competitive markets, and the trend is growing as designs become increasingly heterogeneous and targeted to specific workloads and applications. From the edge to the cloud, including everything from vehicles, smartphones, to commercial and industrial machinery, the trend increasingly is on maximizing performance using the least amount of energy. This ... » read more

Making Sense Of New Edge-Inference Architectures


New edge-inference machine-learning architectures have been arriving at an astounding rate over the last year. Making sense of them all is a challenge. To begin with, not all ML architectures are alike. One of the complicating factors in understanding the different machine-learning architectures is the nomenclature used to describe them. You’ll see terms like “sea-of-MACs,” “systolic... » read more

FeFETs Bring Promise And Challenges


Ferroelectric FETs (FeFETs) and memory (FeRAM) are generating high levels of interest in the research community. Based on a physical mechanism that hasn’t yet been commercially exploited, they join the other interesting new physics ideas that are in various stages of commercialization. “FeRAM is very promising, but it's like all promising memory technologies — it takes a while to get b... » read more

Data Overload In The Data Center


Dealing with increasing volumes of data inside of data centers requires an understanding of architectures, the flow of data between memory and processors, bandwidth, cache coherency and new memory types and interfaces. Gary Ruggles, senior product marketing manager at Synopsys, talks about how these systems are being revamped to improve performance and reduce power. » read more

Power/Performance Bits: Dec. 7


Logic-in-memory with MoS2 Engineers at École Polytechnique Fédérale de Lausanne (EPFL) built a logic-in-memory device using molybdenum disulfide (MoS2) as the channel material. MoS2 is a three-atom-thick 2D material and excellent semiconductor. The new chip is based on floating-gate field-effect transistors (FGFETs) that can hold electric charges for long periods. MoS2 is particularly se... » read more

Challenges At 3/2nm


David Fried, vice president of computational products at Lam Research, talks about issues at upcoming process nodes, the move to EUV lithography and nanosheet transistors, and how process variation can affect yield and device performance. » read more

Memory Access In AI Systems


Memory access is a key consideration in AI system design. Ron Lowman, strategic marketing manager for IP at Synopsys, talks about how memory affects overall power consumption, why partitioning of on-chip and off-chip is so critical to performance and power, and how this changes from the cloud to the edge. » read more

Scaling Up Compute-In-Memory Accelerators


Researchers are zeroing in on new architectures to boost performance by limiting the movement of data in a device, but this is proving to be much harder than it appears. The argument for memory-based computation is familiar by now. Many important computational workloads involve repetitive operations on large datasets. Moving data from memory to the processing unit and back — the so-called ... » read more

What Engineers Are Reading And Watching


By Brian Bailey And Ed Sperling An important indicator of where the chip industry is heading is what engineers are reading and what videos they are watching. While some subjects remain on top, such as the level of interest in the latest manufacturing technologies, other areas come and go. The stories with the biggest traffic numbers are almost identical to last year. Readers want to know wh... » read more

The Next New Memories


Several next-generation memory types are ramping up after years of R&D, but there are still more new memories in the research pipeline. Today, several next-generation memories, such as MRAM, phase-change memory (PCM) and ReRAM, are shipping to one degree or another. Some of the next new memories are extensions of these technologies. Others are based on entirely new technologies or involve ar... » read more

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