tag: Infineon

Chip Industry Week In Review
By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Blog Review: June 19
By Jesse Allen - 19 Jun, 2024 - Comments: 0

Siemens' John McMillan and Todd Burkholder suggest using an automatic formal-based approach to verifying chiplet package connections early in the design process. Cadence's Veena Parthan explores the intricacies of wind tunnel testing in automotive design and how the collaborative relationship between computational fluid dynamics (CFD) and wind tunnels has resulted in accelerated and more nua... » read more

Chip Industry Week In Review
By The SE Staff - 14 Jun, 2024 - Comments: 0

Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Big Shift: Creating Automotive SW Without HW
By Ann Mutschler - 12 Jun, 2024 - Comments: 1

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Blog Review: June 12
By Jesse Allen - 12 Jun, 2024 - Comments: 0

Cadence's Deep Mehta finds that PCIe 6.0 switches need advanced verification strategies that delve deeper than basic functionality, such as generating backpressure traffic to identify potential performance bottlenecks and ensure the switch operates optimally in real-world scenarios. Siemens' Reetika explains why proper management and verification of reset domain crossing (RDC) paths are cruc... » read more

Chip Industry Week In Review
By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Why It’s So Hard To Secure AI Chips
By Adam Kovac - 06 Jun, 2024 - Comments: 0

Demand for high-performance chips designed specifically for AI applications is spiking, driven by massive interest in generative AI at the edge and in the data center, but the rapid growth in this sector also is raising concerns about the security of these devices and the data they process. Generative AI — whether it's OpenAI’s ChatGPT, Anthropic’s Claude, or xAI’s Grok — sifts thr... » read more

Liquid Cooling And GaN: A Winning Combination
By Paul Wiener - 06 Jun, 2024 - Comments: 0

Data centers are facing an unprecedented transformation due to the surge in generative AI and other emerging technologies. A single ChatGPT session consumes 50 to 100 times more energy than a comparable Google search, escalating data center rack power requirements towards 200 kW or more, presenting serious challenges for operators. Cooling, in fact, takes up about 40% of the power requireme... » read more

Gate Drive Configurations For GaN Power Transistors
By Infineon - 05 Jun, 2024 - Comments: 0

This whitepaper gives a compact overview of the recommended gate drive concepts for both GIT (gate injection transistor) and SGT (Schottky gate transistor) product families. A versatile standard drive (RC interface) can be easily adapted to both technologies. The document also provides basic gate drive dimensioning guidelines and some typical application examples. Find more information here. » read more

Blog Review: June 5
By Jesse Allen - 05 Jun, 2024 - Comments: 0

Cadence's Neelabh Singh provides an overview of the low power entry and exit flows in USB4 Version 2.0 link speed and how they have been simplified by making low power entry uni-directional and removing the need for certain handshakes for low power exit of the re-timers. In a podcast, Siemens' Steph Chavez chats with Daniel Beeker of NXP about the foundational importance of power distributio... » read more

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