Optimize Digital Payloads With Radiation Hardened GaN


As the demand for greater communication bandwidth continues to grow, next-generation satellites must deliver higher data throughput for digital payloads. This shift to digital payloads requires engineers to reassess key design parameters, such as material needs, operational factors, and radiation robustness, to ensure optimal performance in their space power systems. Infineon HiRel’s new radi... » read more

Chip Industry Week In Review


TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

Chip Industry Week in Review


Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S.  The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Chip Industry Week in Review


SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Is End-To-End Security Possible?


Looming financial penalties for data breaches are forcing chipmakers to confront end-to-end security, an increasingly complex and daunting problem because no single company controls all the pieces anymore. This is especially apparent in multi-die assemblies, in use today in data centers, and under consideration in automotive and other applications. Multiple chiplets can push performance well... » read more

Security Threats Converge On IoT, Industrial ICs, Physical AI


Devices in a broad range of edge AI applications are increasingly at risk of hacking or tampering, with the stakes varying greatly depending on how much the device can impact and interact with human life. Design methods and protection techniques must now be included up front in the design cycle for optimal protection of consumers and companies as the quantum threat looms. In today’s factor... » read more

Topology Selection For Bidirectional Energy Flow Applications Using WBG Devices


The paper provides an overview of the topology for bidirectional converters and discusses their different usage. Bidirectional energy flow applications are usually found in energy storage systems, battery systems, and can be categorized as grid-connected and DC-DC-connected. In grid-connected applications, two power conversion stages, which are power factor corrector (PFC) rectifier/inverter an... » read more

Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Chip Industry Week In Review


Space Forge autonomously generated plasma aboard its ForgeStar-1 satellite, utilizing extreme low Earth orbit (LEO) conditions needed for gas-phase crystal growth of wide- and ultra-wide bandgap materials, GaN, SiC, aluminum nitride, and diamonds. Copper prices surged to a historic record of $12,600 per metric ton, an increase of more than 40% YOY, which will impact the cost of data center b... » read more

Chip Industry Week in Review


Government funding/defunding NIST is terminating funding for the SMART USA Institute, a CHIPS Act research center focused on digital twins, prompting congressional concern that the decision disrupts active awards and weakens U.S. semiconductor R&D commitments. Korea Zinc was awarded $210M in CHIPS Act funding towards a new $6.6B Tennessee advanced smelter and minerals processing facility,... » read more

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