Week in Review: IoT, Security, Auto

By Jeff Dorsch - 29 Mar, 2019 - Comments: 0

Internet of Things Organizers for the Internet of Things World 2019 conference, coming up on May 13-16 in Santa Clara, Calif., surveyed more than 100 IoT leaders in various industries. Implementation (34%) and security (25%) were the highest concerns for the respondents. Those were followed by initial purchase (17%), scalability (10%), business buy-in (8%), and upkeep costs (3%). Two-thirds of... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 22 Mar, 2019 - Comments: 0

Internet of Things Second-tier cities in the U.S. that can’t attract projects like the Amazon HQ2 are welcoming the testing of autonomous vehicles, smart city technology, and advanced surveillance techniques, this analysis notes. What do they get in return? Much of the time, little or nothing. And bad things can happen. People have been throwing objects at Waymo vehicles in Chandler, Ariz., ... » read more

The Week In Review: IoT

By Jeff Dorsch - 15 Sep, 2017 - Comments: 0

Conferences Artificial intelligence, the Internet of Things, and 5G wireless communications were the talk of this week’s Mobile World Congress Americas event at the Moscone Center in San Francisco. Interesting topics, to be sure, yet they were eclipsed by a panel discussion on Wednesday afternoon about a matter of life or death. At a program put together by 151 Advisors, one of the panel ses... » read more

The Week In Review: IoT

By Jeff Dorsch - 21 Oct, 2016 - Comments: 0

Security The Defense Advanced Research Projects Agency (DARPA) in August held the finals of its Cyber Grand Challenge, a competition that came down to seven teams in Las Vegas, with the three winning teams sharing cash prizes totaling $3.75 million. The capture-the-flag style contest let cybersecurity software counter various attacks on its own, without the aid of engineers and programmers. Th... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week In Review: IoT

The Week In Review: IoT