March’19 Startup Funding: Money Springs Forth

By Jeff Dorsch - 04 Apr, 2019 - Comments: 0

Another month, another couple of billion-dollar rounds. Singapore-based Grab raised nearly $1.5 billion from the SoftBank Vision Fund, bringing its total private funding to more than $4.5 billion and valuing the company at around $14 billion. Grab has acquired Uber’s ride-hailing business in Southeast Asia and now competes chiefly with Go-Jek of Indonesia in Thailand and other emerging mar... » read more

Automotive Electronics: Driving The Semiconductor Market

By Jim Feldhan - 16 Aug, 2018 - Comments: 0

Automotive electronics is the fastest growing end application in the semiconductor market, but what systems will see the highest penetration rates? Currently, self-driving cars grab much of the media attention, and for good reason. Semico estimates that today’s self-driving car has $21,525 of additional electronics. However, recent tests of ADAS vehicles produced less than stellar results. II... » read more

The Week In Review: IoT

By Jeff Dorsch - 29 Sep, 2017 - Comments: 0

Connectivity Sigfox this week held the first annual Sigfox World IoT Expo in Prague, Czech Republic, bringing together network operators, business partners, and industry professionals. The company announced a number of new services for its users, including the Admiral Ivory connectivity service, which promises to make any short-range wireless device into a long-range Internet of Things device,... » read more

Lawyers, Insurance And Self-Driving Cars

By Ann Mutschler - 02 Jun, 2016 - Comments: 1

Self-driving cars are drawing semiconductor companies into legal and regulatory issues for the first time, adding a new level of scrutiny on cutting-edge chip technology. It also opens up a whole new field for legal interpretation, case law, and regulation. While most liability cases in the past never crossed below the system vendor/supplier level, that could change with autonomous vehic... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: insurance

March’19 Startup Funding: Money Springs Forth

Automotive Electronics: Driving The Semiconductor Market

The Week In Review: IoT

Lawyers, Insurance And Self-Driving Cars