Monolithic Vs. Heterogeneous Integration


Experts at the Table: Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what's needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Po... » read more

Americas Chip Funding Energizes Industry


This is the second in a series of articles tracking government chip investments. See part one here (global),  part 3 covering EMEA is here and Asia here. Since the first announcement of a non-binding preliminary memorandum of terms with BAE Systems in December 2023, the U.S. Department of Commerce has rolled out comprehensive plans to support more than a dozen companies in order to shore up... » read more

Chip Industry Week In Review


Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Chip Industry Week In Review


Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Chip Industry Technical Paper Roundup: Oct. 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=365 /] More ReadingTechnical Paper Library home » read more

Government Chip Funding Spreads Globally


This is the first in a series of articles tracking government chip investments. See part two for Americas-focused funding and part three for the UK and EMEA, and part four for Asia. Countries around the world are ramping up investments into their semiconductor industries as part of new or existing approaches. The increased government activity stems from growing awareness of the strategic imp... » read more

Review Paper: Challenges Required To Bring the Energy Consumption Down in Microelectronics (Rice, UC Berkeley, Georgia Tech, Et al.)


A new review article titled "Roadmap on low-power electronics" by researchers at Rice University, UC Berkeley, Georgia Tech, TSMC, Intel, Harvard, et al. This roadmap to energy efficient electronics written by numerous collaborators covers materials, modeling, architectures, manufacturing, metrology and more. Find the technical paper here. September 2024. Ramamoorthy Ramesh, Sayeef Sal... » read more

Research Bits: Oct. 1


Rust-resistant coating for 2D semiconductors Researchers from Pennsylvania State University, National Yang Ming Chiao Tung University in Taiwan, Purdue University, Intel, and the Kurt J. Lesker Company developed a synthesis process to produce a rust-resistant coating with properties ideal for creating faster, more durable electronics. "One of the biggest issues that we see in 2D semiconduct... » read more

Barriers To Chiplet Sockets


Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come through customization of those chiplets. Semiconductor Engineeering sat down to discuss these and other related issues with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technol... » read more

Chip Industry Week In Review


Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

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