The Week in Review: IoT

By Jeff Dorsch - 09 Mar, 2018 - Comments: 0

Finance Toronto-based Ecobee, which markets smart thermostats, raised $61 million in its Series C funding, bringing the total funding for the 11-year-old company to $146 million. Energy Impact Partners led the new round and was joined by Amazon’s Alexa Fund, Relay Ventures, and Thomvest. Ecobee counts Nest Labs, the Google subsidiary, as its chief rival. ThoughtWire, also headquartered in... » read more

Rethinking Patents

By Brian Bailey - 28 May, 2015 - Comments: 0

Over the past few years the pressure on the patent system as a means of protecting intellectual property has been tested to the limit, and many changes are being made in an attempt to keep it viable. But in an age of globalization, coupled with the fact that for the patent system to work there has to be an infrastructure of suitable enforcement, it may be time to rethink its viability—especia... » read more

Advanced SoC Interconnect IP

By Kurt Shuler - 28 Feb, 2013 - Comments: 0

By Kurt Shuler I am thoroughly enjoying 2013. That’s because there seems to be a lot more reason for optimism this year than last year. But before we let go of 2012, it’s important to reflect on the past year and see what it can teach us so we can make better business decisions moving forward. The one lesson learned is that flexibility for SoC designs is increasingly more important. In ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: intellectual property

The Week in Review: IoT

Rethinking Patents

Advanced SoC Interconnect IP