A new technical paper titled "PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies" was published by researchers at ETH Zurich and University of Bologna.
Abstract
"2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-ch...
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