More Consolidation Ahead

By Ed Sperling - 28 Jul, 2016 - Comments: 0

Consolidation fueled by low interest rates is nearing the end, at least for this round. The U.S. Federal Reserve is looking at another rate increase based upon healthy reports on the economy, possibly as early as September. If all goes well, there will be multiple interest rate hikes over the next few years, allowing investors to build more balanced portfolios that are not entirely reliant on t... » read more

What Will China Do Next?

By Ed Sperling - 26 May, 2016 - Comments: 0

China's attempts to buy up U.S. chip companies is undergoing more gyrations, this time spurred by the exchange rate set by the People's Bank of China and the U.S. Federal Reserve's expected interest rate hikes. The central bank dropped the exchange rate of the yuan versus the dollar to its lowest rate since 2011, according to Bloomberg. The current rate is now 6.55 yuan per dollar, compared ... » read more

A Different Kind Of Bottleneck

By Ed Sperling - 07 Sep, 2013 - Comments: 0

Electronics have always lived in troubling times. There have been threats of outsourcing, not to mention re-outsourcing from the outsourcers, constant pressure from startups from around the globe, pricing pressures, government intervention, technological issues, and rising complexity that is now forcing a complete re-thinking of the supply chain. More recently, the demand has been for mobility,... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: interest rates

More Consolidation Ahead

What Will China Do Next?

A Different Kind Of Bottleneck