Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has many advantages for mobile applications such as low power consumption, short signal path, small form factor, and heterogeneous integration for multifunctions. In addition, it can be applied in various package platforms, including PoP, System-in-Package (SiP), and Chip Scale Package (CSP). These advantages come from advanced inte...
» read more
