The Week in Review: IoT

By Jeff Dorsch - 03 Nov, 2017 - Comments: 0

Finance Farmobile has raised $18.1 million in a Series B round of funding, led by Anterra Capital and AmTrust Agricultural Insurance Services, bringing its total funding to more than $28 million. Existing investors also took part in the new round. The agricultural Internet of Things startup will use the money to expand its operations around the world. Farmobile provides agronomic and machine d... » read more

The Week In Review: IoT

By Jeff Dorsch - 11 Aug, 2017 - Comments: 0

Connectivity M1 Limited of Singapore worked with Nokia to launch a nationwide narrowband Internet of Things network, targeting such applications as asset tracking, environmental monitoring, fleet management, and smart energy management for buildings. M1 hopes to boost the IoT ecosystem in Singapore with the new NB-IoT network. M&A DuPont has agreed to acquire Granular, a provider of digita... » read more

Inside The Maker Faire

By Ed Sperling - 01 Jun, 2017 - Comments: 0

The Maker Faire is to the Internet of Things what Comdex once was to the PC, what Mobile World Congress still is to the mobile device, and what CES has become to the automotive industry. It's a collection of the latest ideas and unique implementations that point the way to the big shifts in technology. Most of the companies exhibiting at these shows never make it to become household names. S... » read more

Agricultural IoT: Outstanding In The Field

By Jeff Dorsch - 01 Dec, 2016 - Comments: 0

The Internet of Things represents many different things, for multiple industries and markets. For farmers, it offers the opportunity to take part in another Green Revolution. Precision agriculture is the term often applied to [getkc id="76" kc_name="IoT"]-based farming. What that means is using [getkc id="187" kc_name="sensors"] and other technology to improve agricultural production, involv... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

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by Brian Bailey

Partitioning In The Chiplet Era

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by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: IoT for Agriculture

The Week in Review: IoT

The Week In Review: IoT

Inside The Maker Faire

Agricultural IoT: Outstanding In The Field