Advanced Packaging Picks Up Steam

The semiconductor industry’s push toward continued miniaturization and increasing complexity is driving wider adoption of system-in-package (SiP) technology. One of the big benefits of [getkc id="199" kc_name="SiP"] is that it allows more features to be squeezed into ever-smaller form factors, such as wearable gadgets and medical implants. So while the individual chips in this package may ... » read more

Making 2.5D, Fan-Outs Cheaper

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

GMK: Rethinking The Audio Jack

The lowly audio jack, taken for granted since the days of the transistor radio, is getting a lot of attention these days. Apple thought so little of it, in fact, that it eliminated it altogether with its iPhone 7, choosing to run analog signals through the power cable rather than keeping a separate audio jack. Now GMK, a fabless semiconductor startup in Korea, is taking the reverse approach—r... » read more