Formal Verification Becoming Critical To Auto Security, Safety

By Ann Mutschler - 09 Sep, 2020 - Comments: 0

Formal verification is poised to take on an increasingly significant role in automotive security, building upon its already widespread use in safety-critical applications. Formal has been essential component of automotive semiconductor verification for some time. Even before the advent of ADAS and semi-autonomous vehicles — and functional safety specifications like ISO 26262 and cybersecur... » read more

Cybersecurity Risks In Automotive Electronics

By Sergio Marchese - 04 Sep, 2020 - Comments: 0

I love the summer holidays! Even more when I haven’t much of a plan and can enjoy a sense of freedom and adventure. A few years back, I went traveling with a campervan with a few friends, and we did exactly that. In fact, with the COVID-19 situation, traveling with a campervan is a great holiday option. The only problem is that I don’t quite enjoy driving. I would rather plan my next destin... » read more

Welcome To 6 Minutes Of Security

By Sergio Marchese - 06 Aug, 2020 - Comments: 0

Yet another blog on security! Oh, wait, this is hardware security – and trust. While secure hardware should be free from vulnerabilities in general, I use the term trust to refer to the belief that a semiconductor intellectual property (IP) or integrated circuit (IC) is free from malicious, intentionally inserted vulnerabilities. Hardware security is on the rise. The media is helping. ... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ISO/SAE 21434

Formal Verification Becoming Critical To Auto Security, Safety

Cybersecurity Risks In Automotive Electronics

Welcome To 6 Minutes Of Security