Research Bits: July 1


Copper-to-copper bonding for GaN integration Researchers from MIT, Georgia Tech, and Air Force Research Laboratory propose a bonding process to integrate gallium nitride (GaN) transistors onto standard silicon CMOS chips. They used the process to create a power amplifier. “We wanted to combine the functionality of GaN with the power of digital chips made of silicon, but without having to ... » read more

Power/Performance Bits: Sept. 13


Core-to-core communication Most research featured in the Power/Performance Bits has far-off applications, but a team from North Carolina State University and Intel developed something that could be brought into practice today: a way to accelerate core-to-core communication. Many important workloads incur significant core-to-core communication and are affected significantly by the costs, i... » read more