tag: JCET

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Chip Industry Week In Review
By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 17 Mar, 2023 - Comments: 0

Samsung announced plans to invest $230 billion (300 trillion won) over the next two decades to construct the world’s largest semiconductor manufacturing complex in South Korea’s Gyeonggi Province, reports AP. The complex will consist of five new semiconductor plants producing memory and logic chips. Chips will be the enabling engines, requiring massive investments in new technology, m... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 03 Mar, 2023 - Comments: 0

Security The Biden administration released a National Cybersecurity Strategy report this week, calling on the tech community to shoulder much more responsibility, placing "responsibility on those within our digital ecosystem that are best positioned to reduce risk and shift the consequences of poor cybersecurity away from the most vulnerable in order to make our digital ecosystem more trustwor... » read more

Managing Thermal-Induced Stress In Chips
By Karen Heyman - 16 Feb, 2023 - Comments: 0

At advanced nodes and in the most advanced packages, physics is no one's friend. Escalating density, smaller features, and thinner dies make it more difficult to dissipate heat, and they increase mechanical stress. On the flip side, thinner dielectrics and tighter spaces make it more difficult to insulate and protect against that heat, and in conjunction with those smaller features and higher d... » read more

Bump Reliability is Challenged By Latent Defects
By Karen Heyman - 07 Feb, 2023 - Comments: 0

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Effects are already showing up and will likely only get worse as package densities increase beyond 1,000 bumps per chip. “You comb... » read more

Chip Industry’s Earnings Roundup
By Linda Christensen - 06 Feb, 2023 - Comments: 0

Editor's Note: Updated throughout February 2023 for additional earnings releases. Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes: Demand for consumer electronics softened due to inflation, rising interest rates, and post-pandemic market saturation, creating a slump in the memory chip ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 06 Jan, 2023 - Comments: 0

TSMC is in advanced talks with key suppliers about setting up its first potential European plant in Dresden, Germany, according to Nikkei Asia. The company held a 3nm volume production and capacity expansion ceremony at its Fab 18. TSMC also is building 3nm capacity at its Arizona site, as well as opening a global R&D Center in the Hsinchu Science Park in the second quarter of 2023, to be ... » read more

The March Toward Chiplets
By Ed Sperling and Karen Heyman - 15 Dec, 2022 - Comments: 0

The days of monolithic chips developed at the most advanced process nodes are rapidly dwindling. Nearly everyone working at the leading edge of design is looking toward some type of advanced packaging using discrete heterogeneous components. The challenge now is how to shift the whole chip industry into this disaggregated model. It's going to take time, effort, as well as a substantial reali... » read more

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