The Week In Review: Design

By Ed Sperling - 20 Jun, 2014 - Comments: 0

M&A Cadence completed its acquisition of Jasper Design Automation, using cash and revolving credit to finance the deal. It will explain the impact on 2014 financial results in fiscal 2015. Jasper’s team, led by CEO Kathryn Kranen, will now report to Cadence senior VP Charlie Huang in Cadence’s System & Verification Group. The deal was first announced in April. Tools Coverity un... » read more

The Week In Review: Design

By Ed Sperling - 23 May, 2014 - Comments: 0

M&A Mentor Graphics acquired Nimbic, which makes simulation software for power and signal integrity and electromagnetic interference. No purchase price was given. Synopsys’ Coverity subsidiary acquired Kalistick, which makes cloud-based software solutions to boost test efficiency. Terms of the deal were not provided. Tools and IP Sonics introduced a new development environment for... » read more

The Week In Review: Design

By Ed Sperling - 16 May, 2014 - Comments: 0

M&A Synopsys’ Coverity subsidiary bought Kalistick, a French company that makes cloud-based solutions to boost testing efficiency by allowing engineers to identify and prioritize tests. Terms of the deal were not disclosed. Tools Cadence rolled out verification IP for the new PCI Express 4.0 architecture. The new spec supports up to 16 billion transactions per second, which is double... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Kalistick

The Week In Review: Design

The Week In Review: Design

The Week In Review: Design