Manufacturing Bits: Oct. 5

By Mark LaPedus - 05 Oct, 2021 - Comments: 0

EUV lithography storage ring At the recent SPIE Photomask Technology + EUV Lithography conference, Japan’s High Energy Accelerator Research Organization (KEK) presented a paper on its latest efforts to develop a free-electron laser (FEL) storage ring source power unit for extreme ultraviolet (EUV) lithography. KEK has demonstrated a proof-of-concept EUV-FEL, which has been in R&D. EUV-FEL... » read more

Manufacturing Bits: July 6

By Mark LaPedus - 06 Jul, 2020 - Comments: 1

Luminosity record Japan’s High Energy Accelerator Research Organization (KEK) has regained the world’s record for the highest luminosity achieved in a particle accelerator, beating the previous mark by CERN. KEK achieved the record in the SuperKEKB, a giant storage ring that combines an electron-positron collider with an advanced detector. This system is designed to explore fundamental ... » read more

Manufacturing Bits: April 2

By Mark LaPedus - 02 Apr, 2019 - Comments: 0

Bright particle accelerators The High Energy Accelerator Research Organization (KEK) has reached a major milestone in the world’s most luminous or brightest particle accelerator. KEK has recently made the first physics run in the SuperKEKB, a storage ring that combines an electron-positron collider with a new and advanced detector. Electron-positron collisions have restarted at the SuperK... » read more

Manufacturing Bits: June 26

By Mark LaPedus - 26 Jun, 2018 - Comments: 0

Gummy bear chips The Technical University of Munich (TUM) and Forschungszentrum Jülich have developed a 3D inkjet printing technique to print electrodes on several soft substrates, including gummy bears. The main application is to develop a new class of sensor-based implants for life sciences. For this application, electrodes or microelectrode arrays (MEAs) are developed and printed on sof... » read more

Manufacturing Bits: April 3

By Mark LaPedus - 03 Apr, 2018 - Comments: 0

World's brightest accelerator Japan’s High Energy Accelerator Research Organization (KEK) is readying what is considered the world’s most luminous or brightest particle accelerator. The system, dubbed the SuperKEKB, combines an electron-positron collider with a new and advanced detector. The storage ring system is designed to explore and measure rare decays of elementary particles, such... » read more

Manufacturing Bits: Dec. 12

By Mark LaPedus - 12 Dec, 2017 - Comments: 0

3D diodes At the recent IEEE International Electron Devices Meeting (IEDM) in San Francisco, the Ecole Polytechnique Fédérale de Lausanne (EPFL) and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) presented a paper on what they call the world’s first back-illuminated 3D-stacked, single-photon avalanche diode (SPAD) in 45nm CMOS technology. A SPAD is one type of a photodetector. These... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer