Manufacturing Bits: Dec. 12

3D diodes At the recent IEEE International Electron Devices Meeting (IEDM) in San Francisco, the Ecole Polytechnique Fédérale de Lausanne (EPFL) and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) presented a paper on what they call the world’s first back-illuminated 3D-stacked, single-photon avalanche diode (SPAD) in 45nm CMOS technology. A SPAD is one type of a photodetector. These... » read more