Materials M&A Mania

By Mark LaPedus - 21 Mar, 2019 - Comments: 0

The electronics materials business has seen a wave of mergers and acquisitions in recent times. Clearly, it’s important to keep tabs on this industry. Vendors in the electronics materials business are critical to the supply chain—they provide the key gases, materials and other products for various industries, such as display, MEMS, packaging, semiconductor and others. But it takes a s... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 17 Aug, 2018 - Comments: 0

Trade wars It’s difficult to keep up with the U.S.-China trade war. In the latest event, the U.S. Trade Representative (USTR) recently released a 25% tariff on $16 billion in imports from China. This includes 29 tariff lines that represent the heart of the semiconductor industry, according to SEMI. “SEMI, along with hundreds of companies, including Lam Research and KLA-Tencor, submitted wr... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 08 Apr, 2016 - Comments: 0

Fab tool vendors In terms of sales for 2015, Applied Materials retained the No. 1 position in the wafer fab equipment (WFE) market with 1.3% growth last year, according to Garnter. Lam Research experienced the strongest growth of the top 10 vendors in 2015, moving into the No. 2 position. In the rankings, Lam jumped ahead of ASML and TEL. ASML was in third place, followed in order by TEL, KLA-... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Materials M&A Mania

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing